After successful completion of the course, students are able to ...

• to explain fundamental MEMS-related deposition techniques for thin films (PVD, CVD), to evaluate their corresponding features, advantages and disadvantages as well as important application areas in devices.
• to outline the basics of optical lithography and to describe relevant process steps in photolithography.
• to comprehensively explain dry and wet-chemical etching processes used in MEMS, to analyze their corresponding features, advantages and disadvantages as well as application areas for device realization.
• to analyze the advantages and disadvantages of the modeling of MEMS devices based on the finite element method.
• to describe the main features of the finite element method.
• to give an overview of typical physical sensors (strain, pressure, acceleration, yaw rate, flow, temperature).
• to explain the basic principle of operation for typical physical sensors (strain, pressure, acceleration, rate of rotation, flow, temperature), to evaluate different realization concepts in MEMS devices and to analyze typical fields of application.
• to describe MEMS sensor applications in automobiles (injector flow sensors, inertial sensors), to explain their functionality, to explain the advantages and disadvantages of these sensors and analyze the manufacturing requirements.
• to explain the physical fundamentals of thermoelectric generators for energy harvesting and explain their application for self-powered sensor nodes in aircrafts.

The lecture is divided into 3 sections: in the first, key technologies for the realization of MEMS (micro electromechanical systems) sensors are presented. These include PVD (physical vapor deposition) and CVD (chemical vapor deposition) based thin film disposition techniques as well as fundamentals of optical lithography and etching. In addition, we present theoretical principles for modeling MEMS devices based on the finite element method. Furthermore, some examples are discussed to demonstrate the limits of FEM. In the second section, various realization concepts for MEMS are evaluated to sense physical quantities such as pressure, acceleration, rotation rate, flow and temperature. The fundamental principles of operation are explained, and typical application areas are introduced. In the third section, specific sensors for selected physical quantities and their integration into technical systems, such as automobiles or aircrafts, are introduced. Also actual research topics, such as the local energy supply of sensor nodes from the environment (energy harvesting), are addressed. It is the main goal of the lecture to provide to the students basic MEMS knowledge ranging from technology aspects via device realization to the system integration of selected MEMS sensor elements. The presentation and discussion of selected examples from actual research topics in the field of MEMS sensors as well as energy harvesting complete the lecture.

• Lecture and exercise
• Lecture slides are available as handouts

IMPORTANT:

Due to the new regulations for future face-to-face exams, we are planning - from June to September 2020 - to offer several written exam dates with a smaller number of participants.
In the next few weeks, these dates will be coordinated at the faculty and will be advertised in TISS from the end of May / beginning of June.

Multiple opportunities during the academic year for written exams.

Die Vortragsfolien stehen als Handouts zur Verfügung.

Further literature:

U. Mescheder:
    Mikrosystemtechnik
    Konzept und Anwendungen
    Teubner-Verlag, Stuttgart
    ISBN 3-519-06256-9


G. Gerlach, W. Dötzel
    Grundlagen der Mikrosystemtechnik
    Hanser Verlag, München
    ISBN 3-446-18395-7

W. Menz, J. Mohr:
    Mikrosystemtechnik für Ingenieure
    VCH, Weinheim
    ISBN: 3-527-294055-8

M. Madou:
    Fundamentals of Microfabrication
    CRC Press, Boca Raton
    ISBN: 0-8493-9451-1