After successful completion of the course, students are able to...

to name all major manufacturing processes of micro- & nano-structuring and to explain the principles. The students learn to compare different production processes and to weigh the pros and cons critically. This LVA gives students the understanding to develop process sequences for the complete production of components of microelectronics, photonics and microsystems technology by combining the learned manufacturing processes independently.

Comprehensive knowledge of the processes and technologies that form the basis for modern nanoelectronics, nanophotonics and microsystems technology. Elemental and compound semiconductor of group IV and III-V and oxide ceramics are the focus on the material side.

Process technologies for the manufacture of micro- and nano-scale, 1-, 2- and 3-dimensional structures, components and devices. Primary concerns are the key processes including layer structure with photo- and electron beam lithography and etching techniques with RF plasma processes, selective growth processes for (quasi-) 1-, 2- dimensional structures such as nanodots and nanowires, and in-situ and ex-situ Characterization methods.

Lecture supported with ppt slides and blackboard drawings
Narratives from the practice of industrial production
Case examples for application
Joint development of process sequences (process integration) for the production of a microelectronic or micromechanical device

Will be held again as a face-to-face lecture in WS 2022/23.

Due to scheduling conflicts with other lectures in room CB0102, a new lecture date had to be found. Therefore, the lecture will be held in WS 2022/23 in Sem 362-1 (CH0236) in the Nanocenter every Thursday 13h-15h.


Expected program:

Thu 06 Oct - Heinz Wanzenboeck - Litho 1
Thu 13 Oct - Heinz Wanzenboeck - Litho 2
Thu 20 Oct - Heinz Wanzenboeck - Si & SiO2
Thu 27 Oct - not applicable
Thu 03 Nov - Heinz Wanzenboeck - Deposition

Thu 10 Nov - Ulrich Schmid - Doping
Thu 17 Nov - Ulrich Schmid - wet etching
Thu 24 Nov - Ulrich Schmid - dry etching
Thu 01. Dec - Ulrich Schmid - bonding (wafer level)
Thu 15. Dec - Uli + Heinz (integration to overall process)

Thu 22 Dec - Borislav Hinkov
Thu 12 Jan - Borislav Hinkov
Thu 19 Jan - Borislav Hinkov
Thu 26 Jan - Borislav Hinkov

Oral exam

The examination of the full lecture content can be taken at each of the lecturers - registration with the chosen examiner.

Examiner Wanzenböck:
Registration for given dates via TISS
Additional dates available on request at any time -

Examiner Ulrich Schmid:
Dates by individual agreement

Examiner Borislav Hinkov:
Dates by individual agreement